Dipanshu Baranwal is a Build and Automation Engineer at IBM, with prior experience as a Senior Software Engineer and Software Engineer Intern at Radisys. In the role at Radisys from July 2019 to October 2025, Dipanshu developed a product for controlling various modules across different RAN architectures, focusing on configuration modifications and module management. Previous experience includes working on L1 L2 integration for different vendors, involving message validation over the Fapi interface, as well as an internship focused on 5G NR. Dipanshu holds a Master of Computer Applications (MCA) in Computer Software Engineering from the National Institute of Technology Karnataka and a Bachelor of Computer Applications (BCA) in Computer Programming from the United Institute Of Management.
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