Bill Fleck

Bill Fleck has over 40 years of experience in the automotive and semiconductor industries. Bill began their career in 1979 as a Sales Representative/Systems Engineer for the Hewlett Packard Instrumentation Group, where they sold electronic instrumentation products and served as an area sales and technical expert on HP's logic and communication/protocol analysis products. In 1990, they moved to Mentor Graphics as a Senior Account Manager. In 1995, they joined Synopsys in the same role. In 1998, they were appointed Business Development Manager for Telematics/Driver Information Systems at Motorola Freescale Semiconductor, where they developed requirements and managed the introduction of the successful MPC5200 PowerPC processor into the automotive telematics and consumer markets. In 2005, they joined Gracenote as Vice President of Automotive, Americas, where they managed direct sales to all North American automotive OEMs and Tier Ones, and coordinated cross-regional automotive engagements in Europe, Japan, Korea, India and China. In 2022, they joined Innovusion as Vice President Worldwide Automotive Solutions.

Bill Fleck earned a Bachelor's degree in Electrical Engineering from UC San Diego.