Ahmed Abdelnaby

Ahmed Abdelnaby is an experienced Process Engineer with a focus on wafer-level assembly at Intel Corporation since June 2020. Prior to this role, Ahmed worked at Micron Technology for eight years, contributing to Chemical Mechanical Planarization (CMP) and advanced packaging processes. Ahmed also served as General Chair for the IEEE Workshop on Microelectronics and Electron Devices from July 2018 to April 2019. Academic credentials include a PhD in Mechanical Engineering from the University of Idaho, as well as a Master's and Bachelor's in Mechanical Engineering from the Arab Academy for Science, Technology and Maritime Transport.