Bindu Sree Matam

Bindu Sree Matam is currently a Senior SoC Verification Engineer at Intel Corporation, where they focus on Testplan/Testcase development and regression analysis for PCIe SoC verification. Previously, Bindu worked as a Pre-Silicon Verification Engineer, contributing to interconnect validation and debug features for ARM-based SoCs. Bindu also has experience as an Undergraduate Technical Intern at Intel, where they engaged in pre-silicon validation of core IP designs. Bindu holds a Bachelor of Technology in Electronics and Communications Engineering from Rajiv Gandhi University of Knowledge Technologies, obtained in 2019.