Melissa Hillman is a seasoned packaging engineer with extensive experience in designing and implementing packaging solutions for the automotive, technology, and electronics industries. Hillman's career began at Michigan State University as a Student Library Assistant, progressing to roles including Graduate Teaching Assistant. Experience includes a significant tenure at Visteon Corporation, where management of returnable packaging for automotive electronics was a key responsibility, followed by a role at Sun Microsystems before its acquisition by Oracle. At Oracle, Hillman focused on packaging design for computer hardware products, and currently at Intel Corporation, engages in innovative packaging solutions for advanced products such as NUCs and NIC cards. Hillman's educational background includes a Master of Science in Packaging and a Master of Library & Information Science, along with dual bachelor's degrees in Packaging and History from Michigan State University.
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