Philip Yashar

Philip Yashar is a Principal Engineer at Intel Corporation since June 2019, focusing on Portland Technology Development. Previously, Philip worked as a Process Development Engineer at Qorvo, Inc., where responsibilities included improving reliability and process stability for next-generation heterojunction bipolar transistor (HBT) GaAs processes. Philip has a long history at Intel Corporation, serving as Engineering Manager and Senior Process Engineer, where contributions included the development of PVD metal deposition processes across multiple process technologies. Early experience includes a postdoctoral fellowship at Los Alamos National Laboratory, specializing in magnetic thin films. Philip holds a PhD in Materials Science & Engineering from Northwestern University and a BS in Metallurgical Engineering from the University of Illinois Urbana-Champaign.