Prabhakaran Murugesan

Prabhakaran Murugesan is an experienced IC Package Substrate Design Engineer at Intel Corporation since August 2022, specializing in flip chip BGA package design and coordinating multiple design support requests. Prior to this role, Prabhakaran served as a Senior Printed Circuit Board Designer at HTC Global Services from January 2021 to July 2022, focusing on PCB designs for medical devices and commercial equipment with expertise in interface routing and length matching. From June 2016 to January 2021, Prabhakaran was a Design Engineer at Caliber Interconnect Solutions Pvt Ltd, responsible for designing PCBs and substrates from schematic to finished files for manufacturing. Prabhakaran holds a Bachelor's degree in Electrical and Electronics Engineering from Kamaraj College of Engineering and Technology, along with a Higher Secondary degree in Mathematics and Computer Science and an SSLC from Devasakayam Matric. Hr. Sec. School.