Taehun Lee is an experienced engineering manager currently leading the Failure Analysis and Auto Metrology Development Group at Intel Corporation, where responsibilities include overseeing high-volume and high-precision TEM automation for advanced process development. Prior to this role, Taehun served as a staff FA engineer, focusing on AutoTEM technology development and failure analysis across various technology nodes, including 7nm, 10nm, and 14nm. Additionally, Taehun contributed as a senior process development engineer, pioneering AutoTEM sample preparation technology and conducting failure analysis for multiple technology generations. Taehun's early career includes a co-op internship at IBM, specializing in 3D electron tomography development. Taehun holds a Ph.D. and an MS in Electrical Engineering from The University of Texas at Dallas.
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