Tarun Bansal, PhD, MBA in Finance and Healthcare Administration, has an extensive background in engineering and research, with a focus on semiconductor processes and environmental systems. Current positions at Intel Corporation include Platform Lead and Senior Engineering Manager in Advanced Packaging R&D, building on previous roles at Micron Technology and IM Flash, where Tarun developed wet etch processes for 3D xPoint architecture. Educational qualifications include a PhD in Chemical Engineering from Texas A&M University and an MBA from Texas A&M University-Corpus Christi. Notable achievements include the issuance of a US patent in capped magnetic memory and recognition for groundbreaking research in chemical engineering, supported by multiple awards and citations.
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