JCET Group
Edmund Chew is a skilled Process Engineer with experience at STATS ChipPAC since October 2020, previously holding the role of Senior Associate Process Engineer. Prior to this, Edmund completed an Operations & Maintenance Internship at Keppel Infrastructure Holdings Pte Ltd from August 2019 to January 2020 and a Quality Control Internship at Kim Sin Medicine Manufactory Pte. Ltd. in 2015. Edmund holds a Bachelor's degree in Chemical Engineering from Singapore Institute of Technology, attained between 2018 and 2020, and a High School Diploma in Chemical and Biomolecular Engineering from Ngee Ann Polytechnic, completed from 2013 to 2016.
This person is not in any offices
JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.