JCET Group
Philip Zeng is a seasoned professional with extensive experience in operations management and supply chain, highlighted by a tenure at STATS ChipPAC Ltd. from November 2005 to present as a Senior Operations Manager, overseeing the package assembly line operations and successfully leading a major production ramp-up. With a foundation in industrial engineering from Jiangsu University and an MBA from Shanghai Jiao Tong University, Philip Zeng progressed from a Planning Specialist at Quanta Computer Inc. to a Senior Operations Manager at SCC, where notable achievements included enhancing operational excellence for major clients such as Sandisk and QCOMM. Prior experience includes industrial engineering roles at Delta Electronics Jiangsu Co., Ltd., focusing on process optimization and productivity.
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JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.