Ping W. currently serves as the China Innovation Center Site Leader and Global R&D Director at Leica Microsystems since July 2019, leading R&D teams and managing external partnerships to drive project execution compliant with ISO13485 standards. Previous experience includes roles at TF-AMD as a Senior Manager in Product Development Engineering, at AMD managing product development engineering teams for CPU and GPU testing, as well as positions at Macronix International Co., LTD and Taiwan Video System CO., Ltd in engineering roles focused on firmware development and hardware design. Ping W. holds a GMBA in Business Administration and Management from The University of Manchester and a Bachelor's degree in Electronic Information Engineering from Suzhou University of Science and Technology.
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