Ei Chong Chan

EI CHONG CHAN is a seasoned engineering professional with extensive experience in the semiconductor industry. Currently serving as a Senior Flip Chip Development Engineer at Lumileds since September 2022, EI CHONG CHAN previously held the position of Flip Chip Bonding Engineer at Qualcomm from December 2019 to September 2022, where responsibilities included process ownership for Flip Chip Bonding, Reflow Soldering, and AOI processes, as well as leading the development of a 3D Automated Optical Inspection system. Prior to these roles, EI CHONG CHAN worked at Siltronic AG as a Process Engineer from January 2018 to May 2019, achieving significant reductions in wafer defect rates and improving key performance indicators in the Multi Wire Saw ingot slicing process. Starting in September 2012, EI CHONG CHAN served as a Senior Process Engineer at Western Digital, managing the transfer of a manufacturing process from the US to Singapore while collaborating with the US Process Development Team on new product launches.