Hideo Kageyama

Hideo Kageyama has a strong background in the field of packaging development and engineering. Hideo started their career in 1996 at TOWA CORPORATION, where they worked as a Project Leader, leading the development of high volume automated assembly systems. Hideo was directly responsible for the development of various technologies related to flip chip and stacked die assembly. In 2006, they joined TOWA America Corporation as the Director of Engineering, managing a technical group focused on LED and Semiconductor assembly technologies. Hideo played a key role in developing system solutions and maintaining emerging technology strategies. In 2010, Hideo moved to Philips Lumileds Lighting, where they worked as a Senior Staff Development Engineer. Hideo then transitioned to Lumileds in 2011, taking on roles of increasing responsibility, including Senior Manager of Packaging Development and currently serving as the Director of Packaging Technology Development. Throughout their career, Hideo has consistently contributed to the development and implementation of new process and tools for phosphor integration technologies, as well as collaborating closely with manufacturing teams in Asia to transfer new technology for production preparation.

Hideo Kageyama earned a Master of Engineering (MEng) degree in Electronics and Mechanical Engineering from Osaka Electro-Communication University between 1994 and 1996.