Hyochon Lee

Hyochon Lee is a seasoned HW Reliability Engineer at 메디트 since August 2021, responsible for leading reliability efforts of the i700 wireless model, firmware verification across all models, and conducting circuit stress analysis, transient analysis, and MTBF prediction, as well as performing market defect analysis. Prior to this role, Hyochon served as a Hardware Specialist at HP from November 2016 to August 2021, focusing on A3 Copier Harmonics and Flicker Debugging. Hyochon's experience also includes a tenure as a Senior Engineer at Samsung Electronics from February 2006 to October 2016, where development of the CAD Stress Check System was a key responsibility in collaboration with the Samsung Advanced Institute of Technology. Hyochon holds a bachelor's degree in industrial engineering from Ajou University, attained in February 2006.