Darin Nguyen is a seasoned engineer with extensive experience in the semiconductor industry, currently serving as a Senior Technical Staff Design Engineer at Microchip Technology Inc. since October 2018. Prior to this role, Darin worked at Intel Corporation as a Lead Design Engineer from July 2013 to October 2018. Earlier positions include Analog/RF IC Design Engineer at Fujitsu Semiconductor Wireless Products, Staff Analog RFIC Design Engineer at SiRF Technology, and Senior II Analog IC Design Engineer at RFMD. Darin began the career as an Analog RF IC Design Engineer at Motorola Semiconductor. Academic qualifications include a Master of Science in Electrical Engineering from Arizona State University and a Bachelor of Science in Electrical Engineering from Michigan State University.
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