Daniel Rave

Daniel Rave is currently the Principal Dry Etch Process Development Engineering Lead at Micron Technology, where they focus on advanced dry etch processes for semiconductor applications. They hold a Master of Science in Mechanical Engineering from the University of Minnesota-Twin Cities and a Bachelor of Science in Mechanical Engineering from the University of Notre Dame. In previous roles, Daniel has contributed as a Research Fellow and Teaching Assistant, applying their extensive knowledge of plasma physics and semiconductor device fabrication. Their expertise includes plasma diagnostics, heat transfer, and fluid mechanics, underpinned by a strong background in thermodynamic analysis.