Dongxiang Liao

Dongxiang Liao serves as a Principal Engineer in Media System Architecture at Micron Technology since May 2022, where significant contributions include the development of mobile and data center media algorithms, yielding over 10 patent applications. Prior experience includes a role as Technologist in Memory Productization at Western Digital, focusing on cell development for BiCS4 and BiCS6 technology, and achieving a patent for SLC tProg improvement. As a Device Engineer at SanDisk®, Liao contributed to the development of health metrics for 3D NAND memory, earning 7 patents. Early career roles include Applications Engineer at Molecular Imprints, Inc., MTS at Spansion, and a post-doctoral position at the University of Illinois at Urbana-Champaign, where research concentrated on nanomaterials and MEMS technology. Liao holds a Ph.D. in Materials Science from the University of Illinois Urbana-Champaign and a B.S. in Materials Science from Tsinghua University.