Multibeam Corporation
Tsenguun Byambadorj, Ph.D., currently serves as a Senior Process Engineer at Multibeam Corporation since 2023. Previously, Tsenguun was a Graduate Rotation Engineer at Lam Research from 2022 to 2023, focusing on advanced technology development, CVD/ALD metals hardware engineering, and etch product development. Educational credentials include a Ph.D. in Electrical Engineering from the University of Michigan, a Master's degree in Electrical Engineering from Marquette University, and a double major Bachelor of Science in Electrical Engineering and Physics from South Dakota State University. Research experience includes significant contributions at the University of Michigan's Wireless Integrated MicroSensing & Systems Center, where Tsenguun designed and characterized innovative gas micropumps, and at Marquette University, involving commercialization efforts for novel flow meter devices and the fabrication of highly sensitive sensor devices.
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Multibeam Corporation
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Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications. It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity. Innovated by patterning and wafer fab equipment experts, our systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.