Sai Sirish Gokavarapu

Sai Sirish Gokavarapu has worked in a variety of roles in both the corporate and academic sectors. In 2023, they began working as a Mechanical Engineer - Surgical Instruments at Neocis. In 2022, they were a Graduate Teaching Assistant at the University of Michigan, a Product Manager Intern at Illumina, and an Analytics Associate at IQVIA and 159 Solutions, Inc. In 2021, they were the Vice President - Finance and External Affairs at Sling Health. In 2019, they were a Research Intern at the National University of Singapore. In 2018, they were a Special Auditing Student at Hiroshima University. In 2016, they were a Senior Member and Signatory at the Corroboration and Review Committee at BITS Pilani. In 2015, they were a Core Member at the Department of Reception and Accommodation at BITS Pilani.

Sai Sirish Gokavarapu has an education history that spans from 2002 to present. Sai Sirish attended Kendriya Vidyalaya from 2002 to 2013. Sai Sirish then attended Birla Institute of Technology and Science, Pilani from 2015 to 2020, where they earned an Integrated Majors, M.Sc (Hons.) Biological Sciences + B.E.(Hons.) in Mechanical Engineering. Sai Sirish is currently pursuing a Master of Science in Biomedical/Medical Engineering at the University of Michigan.