Mike Campbell is a highly experienced professional in the field of printed circuit board (PCB) design, currently serving as a Senior Printed Circuit Board Designer at Neosem Technology Inc since August 2021, focusing on semiconductor test equipment. Prior roles include PCB Designer at Lockheed Martin and PCB Design Engineer at Abaco Systems, Inc. Additionally, Mike has held significant positions such as Lead Sr PCB Designer and Manager of Hardware Engineering at Arista Networks, and Senior Hardware Design Engineer at NetApp, where involvement in the acquisition of LSI occurred. With a foundational background at LSI Logic and various design roles through notable companies like Seagate Technology and Sony Electronics, Mike's expertise includes extensive PCB design for advanced storage and networking products, utilizing a variety of technologies and methodologies. Education includes training from the Colorado Mountain College, US Army Intelligence Center and School, and USAF Intelligence Research Center.
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