Melvin Chew Chee Hung

Melvin Chew Chee Hung has extensive experience in the semiconductor industry, currently serving as Senior Director and Head of Package R&D at Nexperia since February 2017, where responsibilities include managing a global team across multiple countries. Previously, Melvin held various roles at NXP Semiconductors from 2006 to February 2017, including Innovation Manager and Development Manager, focusing on package innovation and new product introduction. Earlier experience at Philips Semiconductors involved roles as Senior Equipment Engineer and Process & Product Engineer, emphasizing equipment setup and process development. Melvin earned a Bachelor's degree in Electrical and Electronics Engineering from the University of Leeds between 1997 and 1999.