Thijs van der Aa

Thijs van der Aa is a skilled process and chemical engineer with extensive experience in process development and optimization, particularly in the semiconductor and composites industries. Currently a Process Engineer at Nexperia since February 2017, Thijs focuses on die bond RFID proto machines. Prior roles include serving as a Chemical/Process Engineer at Employeneur TMC and NXP Semiconductors, where similar projects were undertaken. Thijs also worked as a Composite Engineer at VDL Fibertech Industries, developing and enhancing composite products and establishing testing protocols. Previous experience includes a technician position at Sabic Innovative Plastics and an academic background in Molecular Science and Engineering from Fontys Hogescholen, complemented by a graduation project on acrylic oligomers at DSM Coating Resins.