Daniel

Sin Sien Liew is a Global Packing Engineering Manager at NXP Semiconductors, where they are responsible for all aspects of Packing Media, including design, qualification, standardization, and documentation. Previously, they managed a team of Equipment Engineers and Technicians, focusing on equipment performance and mentoring Green Belt candidates in Six Sigma methodologies. Sin Sien holds a Bachelor of Engineering in Mechanical Engineering from the University of Technology Malaysia and has extensive experience in the semiconductor industry, having served in various engineering roles at Motorola Semiconductors. They are recognized for their leadership skills and commitment to process improvement.