Dianbo

Dianbo, Tim, L. is an experienced engineer specializing in RF and wireless development, with a career spanning over 18 years in the semiconductor industry. Currently serving as a Senior Principal RF/Wireless Development Engineer at NXP Semiconductors since December 2019, Dianbo focuses on Wireless WiFi PLL and Clock Distribution IC design. Previous roles include Senior Staff RF/Mix Signal IC Design Engineer at Marvell Semiconductor and Senior Staff RF/MS IC Design Engineer at MaxLinear, both contributing to similar areas of expertise. Additionally, Dianbo has held positions at Intel, including analog engineer and product development engineer, with responsibilities in high-speed I/O IC design and RFID IC bench testing. Dianbo holds a Master of Science degree in Electrical Engineering from the University of Florida.