Phil Lafleur

Senior Vice President, Hardware Engineering at ORBCOMM

Phil Lafleur has a significant amount of work experience in the technology industry. Phil served as Senior Vice President of Hardware Engineering at ORBCOMM since September 2014. Prior to that, they worked at Resonance Microwave Systems Inc. for over 16 years as an RF Antenna Consultant, where they were involved in various projects related to antenna and RF design, manufacturing test strategy, and satellite communications products and services. Additionally, Phil worked as a Consultant at Flextronics, DAP Technologies, iDirect, SkyWave Mobile Communications, and Ximaera during different periods between 2006 and 2012. Phil also worked as a Manager of RF Engineering at TransCore and Vistar in the early 2000s.

Phil Lafleur obtained a Master's degree in Electrical Engineering from Carleton University between 1996 and 1998.

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Timeline

  • Senior Vice President, Hardware Engineering

    September, 2014 - present

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