PiBond
Jarkko Pietikäinen has a diverse work experience in the chemical industry. Jarkko has held various roles at PiBond, starting in 2014 as a Senior Materials Chemist. Jarkko later transitioned to become the R&D and QA Director, responsible for research and quality assurance. From November 2014 to April 2022, Jarkko served as the Production and QA Director, overseeing production processes and ensuring product quality. In April 2022, they were promoted to the role of Senior Director, Global EHSQ, where they are currently responsible for global environmental, health, safety, and quality matters. Prior to their time at PiBond, Jarkko worked at Silecs Oy as a Senior Materials Chemist from April 2001 to August 2008. Jarkko then became the Quality Manager, responsible for ensuring product quality, and later joined the Board as a Member. Jarkko's expertise spans research and development, quality management, and environmental health and safety in the chemical industry.
Jarkko Pietikäinen earned their PhD in Chemistry from the University of Oulu, where they studied from 1992 to 2001.
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PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.