PiBond
Oskari Kähkönen has extensive work experience in the field of chemistry and laboratory management. Oskari is currently working at PiBond as a QC Laboratory Manager since March 2023. Prior to this role, they worked as a Chemist at PiBond from August 2021 to March 2023.
Before joining PiBond, Oskari worked at Sooma Medical as a Production Engineer from April 2020 to July 2021. Oskari also has experience as a Laboratory Engineer at Borealis Polymers Oy from September 2019 to January 2020.
Oskari's earlier roles include working as a Laboratory Engineer at PiBond from July 2014 to September 2019, a Laboratory Technician at Silecs Oy from March 2013 to July 2014, and a Laboratory Technician at Oulu Waterworks / Oulun Vesi from May 2012 to June 2012. Oskari also worked as a Research Assistant at the University of Oulu from May 2010 to August 2010.
Oskari Kähkönen pursued their education at Oulu University of Applied Sciences from 2009 to 2012. During this time, they successfully completed their Bachelor's degree in Laboratory Services with a specialization in Analytical Chemistry. In addition to their formal education, Oskari has obtained several certifications. In September 2019, they received their Occupational Safety Card from Työturvallisuuskeskus ry. Oskari further enhanced their skills by completing a First Aid Course I, offered by the Finnish Red Cross - Suomen Punainen Risti, in November 2020. Oskari has also completed the Elements of AI program, provided by the University of Helsinki and Reaktor, although the exact month and year of completion are not specified.
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.