PiBond
Sampo Simolin's work experience includes working as a Software/Graphics Engineer at PiBond since April 2022. Prior to that, from August 2021 to March 2022, they worked at LaDiMo Oy as a Software/Graphics Engineer, where they developed software in C++, and utilized CUDA and OpenGL APIs. From June 2020 to June 2021, Sampo worked at Trenox Ltd. as a Software Developer, implementing software for tower crane automation and anti-collision systems. During their time at Trenox, they also completed their Master's Thesis project on utilizing laser scanners in tower crane automation. Sampo also has experience as a part-time Software Developer at CGI Suomi Oy from January 2018 to March 2020, where they gained proficiency in Visual Studio IDE and C# language. Additionally, they served as a Course Assistant for a C programming language course at Aalto University from January 2018 to May 2018, further enhancing their knowledge of C language. Prior to their software development roles, Sampo worked as a Logistics Worker at Suomen Transval Group Oy from September 2015 to April 2018, and at Inex Partners Oy from June 2015 to August 2015.
Sampo Simolin completed their Master's degree in Mechanical Engineering Related Technologies/Technicians from Aalto University. Sampo pursued their education at this institution from 2013 to 2019.
PiBond
Pibond is manufacture a broad range of unique electronic materials,which meets customers' stringent performance and integration requirements. We currently supply materials from all of our product lines to leading foundries in the world.We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers.Many of the products we manufacture are essential in construction of new, next generation of devices, or helping to reduce our customer’s production costs and improving quality. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.Apart from being used at multiple nodes within the semiconductor industry, Pibond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures.