Qorvo
Thierry Bosson is an experienced executive in the semiconductor industry, currently serving as the Vice President of Global Operations at Qorvo, Inc. since June 2017. In this role, Thierry oversees wafer fabrication operations across multiple states in the U.S. and internationally, including sites in Oregon, Texas, North Carolina, Costa Rica, and Germany. Previously, Thierry held various positions at Texas Instruments from February 2004 to May 2017, including World Wide Wafer Fab Quality Director and General Manager of multiple wafer fabs, overseeing significant operational teams and production lines. Thierry began a career in the industry at STMicroelectronics as a Process Integration Engineer from 1997 to 2004. Thierry holds a Master's degree in Engineering Physics/Applied Physics from Grenoble INP - UGA.
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