Chase Foley

Mechanical Engineer

Chase Foley is a Mechanical Engineer currently working at Quantum Circuits, Inc. since April 2024. Prior to this role, Chase held various positions at ASML from September 2021 to April 2024, advancing from Mechanical Design Engineer II to Mechanical Design Engineer III. Chase's earlier experience includes serving as a Fracture Micromechanics Researcher at Drexel University from April 2020 to June 2021, and as Vice President of the Drexel Esports & Gaming Association during the same period. In 2019, Chase worked as an Aerospace Engineer at Boeing and as a Mechanical Engineer at SRI International from September 2017 to March 2018. Chase began the professional journey as a Student Researcher at Drexel University in 2017. Chase holds a Bachelor's degree and a Master's degree in Mechanical Engineering from Drexel University, completing the undergraduate program in June 2021.

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