Amir Freizeit

Amir Freizeit is a seasoned professional in integrated circuit engineering, currently serving as the Senior Director of IC Engineering at Renesas Electronics since December 2021, where responsibilities include managing IC design and technical programs for connectivity chipsets focused on WiFi, BLE, and Thread technologies. Prior experience includes serving as VP IC Engineering and Senior Director at Celeno, leading the development of a 3rd generation chipset supporting 802.11ac wireless internet. At DSP Group, Amir held the position of VP and IC Division Deputy Manager, overseeing the logic design group and SOC development across various product lines. Additionally, Amir was VP of R&D at CellGuide, managing a diverse team in signal processing and design, and served as Senior Director of Engineering at Zoran Microelectronics, responsible for the application processor product line. Amir holds a Master of Science in Electrical Engineering from the Technion - Israel Institute of Technology and an MBA in Finance from The Open University of Israel.