Km Rafidh Hassan

KM Rafidh Hassan, PhD, is a Staff IC Packaging Engineer at Renesas Electronics America Inc. since August 2021, where responsibilities include defining and managing new package development projects. Previously, a Reliability Engineer at Nokia Bell Labs for a brief period and a Postdoctoral Researcher at Auburn University from August 2015 to July 2021, focusing on the thermo-mechanical reliability of microelectronic packages. Educational qualifications include a PhD and MS in Mechanical Engineering from Auburn University, supplemented by a BS in Mechanical Engineering from Bangladesh University of Engineering and Technology. Additionally, experience spans roles as an adjunct faculty member at several universities in Bangladesh, a consultant for fire safety projects with the International Labour Organization, and significant involvement in department policy-making.