Gus Rinella

Gus Rinella is a seasoned professional in semiconductor and plastic assembly processes, currently serving as a Senior Process Engineer at Rochester Electronics, LLC since August 2016, specializing in die attach process development with expertise in Besi Datacon 2200 EVO and ESEC 2100 sD Advanced I Die Attach Systems. Prior experience includes a tenure at Intel Corporation from October 1998 to January 2016, where Gus held various positions including Sr. Process and Sustaining Equipment Engineer, focusing on process improvement and equipment management, and conducted significant initiatives like implementing a fail-safe system for probe card cleaning. Gus began the career at Digital Equipment Corporation as an Engineering Technician, contributing to the development of die attach processes for advanced chip applications.