At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. 

As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and we’ve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency.

When you need packaging expertise to help you reach your power management goals, let us help you power the future. 

Semiconductor

Packaging Services

Saras Micro Devices

Ron Huemoeller

Tiyada Baldwin-Barnes Mls

Carlos Andres Riera Cercado

Jonathon Greenwood

Eelco Bergman

Richard Sheridan

The Engineering and Product Development team at Saras Micro Devices is responsible for innovating and designing advanced power delivery solutions tailored for high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking, and other demanding applications. The team leverages their expertise in advanced heterogeneous integration and packaging to develop cutting-edge products that minimize power waste, optimize efficiency, and reduce package space by 25%. They collaborate closely to address complex power delivery challenges, ensuring that our solutions consistently meet the needs of the most advanced semiconductor devices.

Engineering and Product Development

Engineering Team

Leadership Team

Engineering and Product Development

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Engineering Team

Leadership Team