At Saras Micro Devices, we are transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge, data-intensive applications like high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), virtual reality (VR), 5G networking and more. 

As packaging experts in the IC world, we understand your power delivery challenges and the technology behind them, and we’ve created a new way to power your innovations. Our novel approach for improving power delivery performance uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency.

When you need packaging expertise to help you reach your power management goals, let us help you power the future. 

Packaging Services

Semiconductor

Saras Micro Devices

Ron Huemoeller

Tiyada Baldwin-Barnes Mls

Carlos Andres Riera Cercado

Jonathon Greenwood

Eelco Bergman

Richard Sheridan

The Engineering Team at Saras Micro Devices is responsible for the design, development, and optimization of advanced power delivery solutions for high-performance semiconductor devices. This includes creating innovative IC packaging methods that enhance power efficiency, minimize waste, and optimize package space. The team comprises experts in electrical testing, microelectronics, industrial processes, R&D, and advanced processes, ensuring cutting-edge solutions for applications in AI, ML, VR, HPC, and 5G networking.

Engineering Team

Leadership Team

Engineering and Product Development

Engineering Team

About

Team members

Other teams at Saras Micro Devices

Leadership Team

Engineering and Product Development