Sarcina Technology LLC
Eric Gunn is an experienced professional in the semiconductor industry, currently serving as an Advisor at Sarcina Technology LLC, Agile Analog, and sureCore Ltd since January 2024, October 2018, and November 2016, respectively. Eric also holds the position of COO at SEMIWISE and has been a Director at Silera Ltd since September 2008. Previous roles include Advisor and Business Development at Nanusens, Advisor and VP of Business Development at MZ TECHNOLOGIES, and COO at Gold Standard Simulations prior to its acquisition by Synopsys in May 2016. Additional experience includes serving as General Manager Europe at Global UniChip Corporation and Account Director Manager at TSMC. Eric Gunn holds a BSc in Electrical and Electronic Engineering from the University of the West of Scotland.
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Sarcina Technology LLC
Founded in 2011, Sarcina Technology is a semiconductor packaging company in Palo Alto, California, USA with a design office in Hsinchu, Taiwan. It is led by industrial veterans from places like AT&T Bell Labs, DEC, Intel and TSMC. Sarcina Technology provides leading US companies with package design and power/signal integrity simulation. In addition, Sarcina offers final test hardware design, program development, and one-stop turnkey service. We work with the world's foremost foundries to ensure high quality products. We've handled everything, from the simplest to the most complex of packages. Our results are self-evident: since its formation, Sarcina's tapeouts have all been first-time successes.