Jue Chen

Manager Next Generation Products at Schweizer Electronic

Jue Chen is an experienced professional with a strong background in engineering and innovation management. Currently serving as Manager of Next Generation Products and Innovation Manager at Schweizer Electronic AG since November 2013, Jue Chen has a proven track record in product development and technological advancements. Prior to this, Jue Chen worked as a Wissenschaftlicher Mitarbeiter at Leibniz Universität Hannover from November 2007 to March 2013, focusing on microproduction technology and conducting several research projects supported by the Deutsche Forschungsgemeinschaft and the Bundesministerium für Bildung und Forschung. Jue Chen's expertise includes the development of microsensors and actuators, optimization of thin-film manufacturing processes, and characterization of magnetic thin films, alongside experience in teaching and academic support. Jue Chen began the career as a Projektingenieur at the Chengdu Traffic Management Bureau between October 1996 and January 2001, further solidifying a diverse skill set in engineering. Jue Chen holds a Ph.D. in Maschinenbau and a Diplom in Elektrotechnik und Elektronik, both from Leibniz Universität Hannover.

Location

Villingen-Schwenningen, Germany

Links


Org chart


Teams


Offices

This person is not in any offices


Schweizer Electronic

Schweizer Electronic AG is a Germany-based manufacturer of printed circuit boards (PCBs). It operates through two segments: Electronic and Systems. The Electronic segment focuses on the development, production and sale of PCBs. The Systems segment offers technologies for integrating active and passive components into a PCB. Its product portfolio comprises heavy copper boards, inlay boards, power combi boards, insulated metal substrates (IMS) boards and cool boards, as well as embedding systems, such as i2 Board for embedding logic semiconductors, p2 Pack to integrate semiconductors with a vertical current flow, Cavity Board, which allows low-lying connecting areas to be assembled and u2 Pack for small and thin multi-chip semiconductor packages.


Employees

501-1,000

Links