Satya Chinnusamy has extensive experience in packaging technology and engineering, currently serving in Packaging Technology Development at Semtech since April 2022. Previous roles include Director of Package Engineering and Senior Packaging Manager at Power Integrations, where responsibilities included managing package development and manufacturing for high and mid power products. Satya also held positions at Semtech, including Director of Package Development, and Packaging Development Manager, focusing on new package solutions for Power and Protection products. Additional experience includes a Staff Packaging Development Engineer role at Maxim Integrated Products and a managerial position at SPEL. Satya holds an MBA from SMU Cox School of Business and a BE in Electrical and Electronics Engineering from PSG College of Technology, supplemented by an Associate degree in Mechanical Engineering.
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