Ágnes Veres-Nagy

R&d Packaging Engineer at Sensirion

Ágnes Veres-Nagy has a diverse work experience spanning multiple industries and roles. Ágnes started their career as a Scientific co-worker at the University of Szeged from July 2009 to September 2011. Ágnes then served as a PhD intern at A*STAR - Agency for Science, Technology and Research from September 2012 to September 2014. Following that, they worked as a Postdoctoral Research Fellow at the University of Szeged from August 2015 to June 2016. Ágnes then joined Bosch Magyarország as a Technology Development Engineer from July 2016 to December 2018. From October 2019 to March 2023, Ágnes worked at ams OSRAM as a Materials Engineer, where they were responsible for the selection and qualification of polymeric optical materials, adhesives, coatings, sealings, etc. to support product- and technology development of optical sensors. Currently, they are employed as an R&D packaging engineer at Sensirion starting from April 2023.

Ágnes Veres-Nagy began their education at the University of Szeged in 2003, where they pursued a BSc + MSc in Environmental Science. Ágnes completed this program in 2009. In 2010, they enrolled in the University of Szeged's Foreign Language Centre and obtained a Certificate in English-Hungarian Scientific Translation in 2012. Ágnes then continued their education at the University of Szeged's Doctoral School of Chemistry from 2011 to 2015, earning a Doctor of Philosophy (PhD) degree in Chemistry and Environmental Science.

In addition to their formal education, Ágnes has also obtained several certifications. Ágnes completed a course on Sustainable Business: Big Issues, Big Changes from Coursera in May 2019. In April 2019, they obtained a certification in More on Change and Sustainability from the University of Colorado System. Ágnes also completed a certification in Sustainability Strategies from LinkedIn in October 2018. Ágnes has additional certifications related to sustainability and engineering design, but the specific details, such as the obtained month and year, are not provided in the information provided.

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Timeline

  • R&d Packaging Engineer

    April, 2023 - present