Alexander Tain

Alexander Tain is a seasoned engineering professional with extensive expertise in system level signal and power integrity. Currently serving as Principal Engineer at SiMa.ai since January 2024, Tain leads signal integrity and power integrity efforts for AI/ML package and PCB system level simulations. Prior to this, Tain held significant roles at Seagate Technology from September 2014 to May 2023, culminating in the position of Managing Principal Engineer, where responsibilities included managing a team of engineers, designing advanced flip chip packages, and architecting comprehensive signal/power integrity flows. Tain's previous experience includes roles at Avago Technologies, Spansion, Procket Networks Inc., and AMD, focusing on package design and signal integrity analysis across various cutting-edge technologies. Tain holds a Bachelor of Science in Electrical Engineering from San José State University.