Sadman Sakib, Ph.D., is a dedicated engineer specializing in semiconductor reliability and device physics, with a robust background in fabrication processes. Currently, they serve as a Staff NAND Array Reliability R&D Engineer at Solidigm, focusing on the reliability mechanisms of 3D NAND technology. Sadman has previously worked as a Senior Engineer at DigiCon Telecommunication Ltd and contributed as a Graduate Research Assistant at the University of Alabama in Huntsville, where they conducted extensive research on flash memory reliability. They hold both a Bachelor's and Master's degree in Applied Physics, Electronics & Communication Engineering from the University of Dhaka.
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