Dieudonné Zonou is a lead IC packages engineer specializing in semiconductor packaging, with expertise ranging from design to manufacturing processes. They obtained a Master's degree in Micro and Nanotechnology from Université Paul Sabatier (Toulouse III) and have built a diverse career, including roles as an R&D engineer at CEA and a support and development engineer at ITANCIA. Dieudonné currently leads the BEOL IC package division at STMicroelectronics, focusing on package design and multi-project management, and has contributed to the field through scientific publications and patents. Additionally, they completed a research internship at LAAS-CNRS Toulouse, where they studied organic light-emitting diodes.
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