Jesse Riedl is a German-French materials engineer with a PhD and a specialized focus on semiconductors. They possess extensive experience in R&D project management, particularly in semiconductor packaging, and are currently a Technical Program Manager at STATS ChipPAC. Having studied and worked in Germany, France, and Portugal, Jesse brings a global perspective and adaptability to diverse environments. Their technical expertise includes packaging technologies and project management in collaborative settings, enhancing international team collaborations through fluency in several languages.
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