Summit Interconnect
- Tom S Doslak Jr.
Tom S Doslak Jr.
Vice President - Business Development at Summit Interconnect
Tom S Doslak Jr. is currently the Vice President of Business Development at Summit Interconnect, the second largest printed circuit board manufacturer in the United States. Previously, Tom S held various roles in sales and marketing at Streamline Circuits Corp., TTM, DDI, and Sigma Circuits. Tom graduated from California State University, Chico in 1991 with a degree in communications.
Timeline
Vice President - Business Development
December, 2018 - present
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