Tarana Wireless
Gopi Krishna currently serves as a Senior Customer Engineer at Tarana Wireless, Inc. since November 2021. Prior to this role, Gopi worked as a Customer Engineer at Qualcomm, where responsibilities included operating Data Throughput test cases and collaborating with ASUS on the Snapdragon 888 5G chipset launch. Experience also includes serving as a Modem Test Engineer at Samsung Electronics America, executing test plans for various telecom functionalities, and working as an SQA Analyst at Explore IT Solutions Pvt. Ltd., focusing on performance and benchmarking for IMS/LTE/UMTS devices. Gopi's early career featured an internship at Bharat Heavy Electricals Limited and a position as an International Student Advisor at Trine University. Gopi holds a Master’s degree in Information Science/Studies from Trine University and a Bachelor of Technology in Computer Science and Engineering from Qis College of Education.