Teledyne MEMS
Murali Pai, MBA, MASc, BEng, is an experienced sales manager currently working at Teledyne MEMS, responsible for new product introductions and generating new business revenues. With a strong background in technical sales, Murali previously held the position of Senior Technical Sales Engineer at Anton Paar Canada, where outstanding sales performance was acknowledged. Murali has also contributed to academia as Co-Chair of Innovation and Entrepreneurship at the University of Alberta, facilitating industry outreach and networking events. Extensive experience includes roles at NAIT focusing on industry liaison and business development, and product development engineering at ACAMP. Murali holds multiple degrees, including an MBA with a focus on Innovation and Entrepreneurship from the University of Alberta, and has a solid foundation in mechanical engineering and advanced computing.
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Teledyne MEMS
Teledyne offers unmatched MEMS capability, from design to prototyping on 150mm wafers to volume 200mm production. Teledyne DALSA and Teledyne Micralyne combine to collaborate with customers offering decades of experience across a vast process portfolio. Our deep expertise in materials and processes, combined with state-of-the-art facilities and collaborative R&D resources drive continuous improvement, learning, and innovation. Teledyne MEMS delivers a scalable suite of MEMS and microfabrication capabilities that allow customers to ramp up to meet their business development goals.