Alexander Hess, Ph.D.

Alexander Hess, Ph.D. has a diverse work experience. Alexander began their career in 2011 as a Research Assistant in the Draper Group at Trinity College Dublin. In the same year, they were awarded a Trans-Atlantic Science Student Exchange Programme Scholarship (TASSEP) to conduct research for their dissertation abroad at the University of North Carolina at Chapel Hill. In 2012, they were awarded an ERC Graduate Research Fellowship to conduct research in Professor Paul D. Beer's Supramolecular chemistry research group at the University of Oxford. From 2016 to 2020, they worked as a Research Scientist at IBM, where they were the photopolymer science/chemistry subject matter expert. In 2020, they became a Berkeley Lab Affiliate for Cypris Materials, Inc., where they were the first hire at the boot-strapped pre seed start up. Alexander was the Polymer and Synthetic Chemistry R&D Lead for exploratory new chemistries for self-assembling brush block copolymer film technology, pre-pilot scale up, production and supply chain de-risking of platform technology chemistries + formulation, interfacing with toll manufacturers, cost reduction, IP strategy and creation, technology transfer, strategic partnerships and product management. In 2021, they became the Senior Scientist - Group Leader at TeraPore Technologies, Inc. and in 2022, they became the Venture Capital Advisor at Starship Ventures.

Alexander Hess, Ph.D. began their educational journey at Newtown School Waterford, where they completed their high school education from 2002 to 2008. Alexander then attended Trinity College Dublin, where they earned a Bachelor of Arts (B.A.) (Mod.) in Chemistry from 2008 to 2012. During 2011, they participated in the Trans-Atlantic Science Student Exchange Programme Scholar at the University of North Carolina at Chapel Hill, also in Chemistry. In 2012, they completed their Doctor of Philosophy (DPhil/Ph.D.) in Chemistry at the University of Oxford. Additionally, they obtained a Scientist MBA from Cheeky Scientist in 2021 and a First Patent from IBM in 2018.