Guotao Wang

Guotao Wang is a highly experienced engineering professional specializing in integrated circuit packaging. Currently serving as a Senior Staff IC Packaging Engineer at Tesla since April 2022, Guotao has previously held significant roles at Apple as an IC Packaging Technologist, at Futurewei Technologies, Inc. as a Principal Engineer, and at Intel, where responsibilities included senior technical leading in Si/Packaging Integration across various engineering capacities. Guotao’s career began at Micron Technology as a Simulation Engineer intern. Academically, Guotao holds a PhD in Materials Science and Engineering from The University of Texas at Austin and a PhD in Solid Mechanics from Tsinghua University.