Thintronics®
Carl Li is an experienced IC Packaging Technologist currently at Thintronics® since March 2025. Previously, Carl served as a Semiconductor Packaging Engineer and Technologist at Applied Materials from August 2021 to March 2025, where responsibilities included leading the development of advanced panel-level organic substrates and integrating various semiconductor processes. As a Graduate Research Assistant at Georgia Institute of Technology from July 2018 to July 2021, Carl invented and demonstrated 'Cobalt ALD Bonding' for low-temperature chip-to-chip bonding. Earlier, at National Cheng Kung University from March 2015 to September 2017, Carl proposed an innovative solution to lithium-ion battery anode expansion, significantly enhancing conductivity and capacity. Carl holds two Master's degrees in Electrical and Computer Engineering and Material Science and Engineering from Georgia Institute of Technology.
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Thintronics®
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We help electronics OEMs use the PCB to drive their product innovation though the implementation of our Thintronics dielectric platform. Whether you're looking to build on a more innovative PCB, or simply bring new space and layer count savings to the design you already have, Thintronics has you covered.